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Zusatztext "...an interesting and useful book; I wholeheartedly recommend it."(Circuit World! Vol.30! No. 2003) Informationen zum Autor RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division. LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives. Klappentext This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.* Describes the processes available for creating integrated passives, measuring their properties, and applying them.* Brings reader up to date in a fast-moving technology.* Enables reader to implement the technology into a manufacturing environment.* Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.* Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation. Zusammenfassung Presenting survey in Integrated Passive Component Technology, this title describes the processes available for creating integrated passives, measuring their properties, and applying them. Inhaltsverzeichnis Contributors. Preface. 1 Introduction ( Richard K. Ulrich ). 1.1 Status and Trends in Discrete Passive Components. 1.2 Definitions and Configurations of Integrated Passives. 1.3 Comparison to Integrated Active Devices. 1.4 Substrates and Interconnect Systems for Integrated Passives. 1.5 Fabrication of Integrated Passives. 1.6 Reasons for Integrating Passive Devices. 1.7 Problems with Integrating Passive Devices. 1.8 Applications for Integrated Passives. 1.9 The Past and Future of Integrated Passives. 1.10 Organization of this Book. References. 2 Characteristics and Performance of Planar Resistors ( Richard K. Ulrich ). 2.1 Performance Parameters. 2.2 Resistance in Electronic Materials. 2.3 Sizing Integrated Resistors. 2.4 Trimming. References. 3 Integrated Resistor Materials and Processes ( Richard K. Ulrich ). 3.1 Single-Component Metals. 3.2 Metal Alloys and Metal-Nonmetal Compounds. 3.3 Semiconductors. 3.4 Cermets. 3.5 Polymer Thick Film. 3.6 Ink Jet Deposition. 3.7 Commercialized Processes. 3.8 Summary. References. 4 Dielectric Materials for Integrated Capacitors ( Richard K. Ulrich ). 4.1 Polarizability and Capacitance. 4.2 Capacitance Density. 4.3 Temperature Effects. 4.4 Frequency and Voltage Effects. 4.5 Aging Effects. 4.6 Composition and Morphology Effects. 4.7 Leakage and Breakdown. 4.8 Dissipation Factor. 4.9 Comparison to EIA Dielectric Classifications. 4.10 Matching Dielectric Materials to Applications. References. 5 Size and Configuration of Integrated Capacitors ( Richard K. Ulrich ). 5.1 Comparison of Integrated and Discrete Areas. 5.2 Layout Options. 5.3 Tolerance. 5.4 Mixed Dielectric Strategies. 5.5 CV Product. 5.6 Maximum Capacitance Density and Breakdown Voltage. References. 6 Processing Integrated Capacitors ( Richard K. Ulrich ). 6.1 Sputtering. 6.2 CVD, PECVD and MOCVD. 6.3 Anodization. 6.4 Sol-Gel and Hydrothermal Ferroelectrics. 6.5 Thin- and Thick-Film Polymers. 6.6 ...
