Fr. 48.90

Ultrasonic engineering and technologies - A physical handbook

English · Paperback / Softback

Shipping usually within 2 to 3 weeks (title will be printed to order)

Description

Read more

This monograph presents physical and technical fundamentals of most ultrasonic processes used in industry such as US processing of thermoplastics (welding, riveting, flanging, embedding, cutting, etc.) and of metals and metal alloys (joining, plastification, stress relieving, measurements of elasticity moduls , reception of acoustic emission, etc.) with application examples and practical instructions as well as with qualitative theoretical calculations of the dissipated US vibration energy and heat production including all US basic parameters (generator power, vibration amplitude and resonance frequency, exposure time) and all material parameters (storage and loss elasticity moduls, density, heat capacity), which allows the process parameters to determin and to set in advance.The monograph is recommended for students, engineers and scientists in this field.

About the author










Viktor Eduard Dr. Prieb ¿ promovierter Physiker, dreisprachiger (Deutsch als Vatersprache, Russisch als Muttersprache, Englisch als Fremdsprache) Dichter, poetischer Übersetzer, Schriftsteller, geboren in Sibirien, im Jahre 1990 ausgesiedelt nach Deutschland, seit 1993 lebt und schöpft "als Dichter und Denker in seinem Deutschen Lande" in Berlin. 

Product details

Authors Viktor Eduard Prieb
Publisher GlobeEdit
 
Languages English
Product format Paperback / Softback
Released 23.09.2022
 
EAN 9786200635198
ISBN 9786200635198
No. of pages 128
Dimensions 150 mm x 7 mm x 220 mm
Weight 188 g
Subject Natural sciences, medicine, IT, technology > Physics, astronomy > Miscellaneous

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.