Electronic Packaging Materials and Their Properties

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
interconnections

printed circuit boards

substrates

encapsulants

dielectrics

die attach materials

electrical contacts

thermal materials

solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

List of contents

Introduction,Properties of Electronics Packaging Materials,Electrical Properties,Thermal and Thermomechanical Properties,Mechanical Properties,Chemical Properties,Miscellaneous Properties,Zeroth-Level Packaging Materials,Semiconductors,Attachment Materials,Substrates,First-Level Packaging Materials,Wire Interconnects,Tape Interconnects,Case Materials,Lid Seals,Leads,Second-Level Packaging Materials,Reinforcement Fiber Materials,Resins,Laminates,Constraining Cores,Flexible Wiring Board Materials,Conductor Metals in Laminates,Conformal Coatings,Third-Level Packaging Materials,Backpanel Materials,Connectors Materials,Cables and Flex Circuit Materials,Summary,Appendices,Index

About the author

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Summary

Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

Product details

• Authors: Rakesh Agarwal, Rakish Agarwal, Agarwal Rakish, Terrance Dishongh, Terrance J. Dishongh, Dishongh Terrance J., Sirus Javadpour, Javadpour Sirus, Rahul Mahajan, Mahajan Rahul, F. Patrick McCluskey, Patrick McCluskey, McCluskey F. Patrick, Michael Pecht, Mitel G. Pecht, Pecht Michael
• Assisted by: Michael Pecht (Editor of the series)
• Publisher: Taylor and Francis
• Languages: English
• Product format: Hardback
• Released: 18.12.1998
• EAN: 9780849396250
• ISBN: 978-0-8493-9625-0
• No. of pages: 120
• Weight: 362 g
• Illustrations: Tabellen, schwarz-weiss
• Series: Electronic Packaging
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Telecommunications, Electronics & Communications Engineering, Electronics and communications engineering