Fr. 295.00

Chung, Deborah D. L. Chung, Deborah D.l. (Composite Materials Research Chung, Deborah D.L. (Composite Materials Research Laboratory Chung, Chung Deborah D L

Materials for Electronic Packaging

English · Hardback

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Description

Zusammenfassung Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. This title examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips.

Product details

Authors	Chung, Deborah D. L. Chung, Deborah D.l. (Composite Materials Research Chung, Deborah D.L. (Composite Materials Research Laboratory Chung, Chung Deborah D L
Publisher	ELSEVIER SCIENCE BV

Languages	English
Product format	Hardback
Released	31.03.1995

EAN	9780750693141
ISBN	978-0-7506-9314-1
No. of pages	368
Subject	Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering

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