Advanced Liquid Metal Cooling For Chip, Device And System

This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category - liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.

With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.

Product details

• Authors: Jing Liu, Jing Liu, Liu Jing
• Publisher: Ingram Publishers Services
• Languages: English
• Product format: Hardback
• Released: 31.05.2022
• EAN: 9789811245855
• ISBN: 978-981-1245-85-5
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; TECHNOLOGY & ENGINEERING / Electronics / Circuits / General, TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics, Electronics: circuits and components, Circuits & components