Wireless Interface Technologies for 3d Ic and Module Integration

Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.

List of contents

1. Introduction - 3D integration and near-field coupling; 2. ThruChip interface - a wireless chip interface; 3. Transmission line coupler - a wireless module connector; 4. The future of computing - 3D SRAM for neural network, eBrain.

About the author

Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE.Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.

Summary

Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.

Product details

• Authors: Tadahiro Kuroda, Tadahiro (University of Tokyo) Kuroda, Tadahiro (University of Tokyo) Yip Kuroda, Wai-Yeung Yip, Wai-Yeung (University of Tokyo) Yip
• Publisher: Cambridge University Press ELT
• Languages: English
• Product format: Hardback
• Released: 30.09.2021
• EAN: 9781108841214
• ISBN: 978-1-108-84121-4
• No. of pages: 300
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; TECHNOLOGY & ENGINEERING / Electronics / Circuits / General, Electronics: circuits and components, Circuits & components