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Chin Kian (Edmund) Liew, Andrew A Malcolm et al, Len Gelman, Chin Kian Liew, Andrew A. Malcolm, Nadin Martin...
Advances in Condition Monitoring and Structural Health Monitoring - WCCM 2019
English · Paperback / Softback
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Description
This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019. The contents focus on digitalisation for condition monitoring with the emergence of the fourth industrial revolution (Industry 4.0) and the Industrial Internet-of-Things (IIoT). The book covers latest research findings in the areas of condition monitoring, structural health monitoring, and non-destructive testing which are relevant for many sectors including aerospace, automotive, civil, oil and gas, marine, and manufacturing industries. Different monitoring systems and non-destructive testing methods are discussed to avoid failures, increase lifespans, and reduce maintenance costs of equipment and machinery. The broad scope of the contents will make this book interesting for academics and professionals working in the areas of non-destructive evaluation and condition monitoring.
List of contents
1. Condition monitoring.- 2. Structural health monitoring.- 3. Non-destructive testing and evaluation.
About the author
Len Gelman, Ph.D., Dr. of Sciences (Habilitation) joined Huddersfield University as Professor, Chair in Signal Processing/Condition Monitoring and Director of Centre for Efficiency and Performance Engineering, in 2017 from Cranfield University, where he worked as Professor and Chair in Vibro-Acoustical Monitoring since 2002. Len developed novel condition monitoring technologies for aircraft engines, gearboxes, bearings, turbines and centrifugal compressors. Len published more than 250 publications, 17 patents and is Co-Editor of 12 Springer books. He is Fellow of: BINDT, International Association of Engineers and Institution of Diagnostic Engineers, Executive Director, International Society for Condition Monitoring, Honorary Technical Editor, International Journal of Condition Monitoring, Editor-in-Chief, International Journal of Engineering Sciences (SCMR), Chair, annual International Condition Monitoring Conferences, Honorary Co-Chair, annual World Congresses of Engineering, Co-Chair, International Congress COMADEM 2019 and Chair, International Scientific Committee of Third World Congress, Condition Monitoring. Len is Editorial Board member of journals Applied Sciences, Electronics, Sensors, International Journal Insight, International Journal of Acoustics and Vibration, International Journal of Prognostics and Health Management, International Journal of Basic and Applied Sciences and International Journal of Pure and Applied Mathematics. He was Chair, First World Congress, Condition Monitoring, Chair, Second World Congress, Engineering Asset Management and Chair, International Committee of Second World Congress, Condition Monitoring. Len is Chair of International CM Groups of ICNDT and EFNDT and Member of ISO Technical Committee, Condition Monitoring. Len made 42 plenary keynotes at major international conferences. He was Visiting Professor at ten Universities abroad. Len received two Rolls-Royce (UK) Awards for Innovation, COMADIT Prize (by British Institute of NDT) for significant contribution through research/development in condition monitoring, Oxford Academic Health Science Network Award, William Smith Prize by UK Institution of Mechanical Engineers and USA Navy Award.
Product details
Assisted by | Chin Kian (Edmund) Liew (Editor), Andrew A Malcolm et al (Editor), Len Gelman (Editor), Chin Kian Liew (Editor), Andrew A. Malcolm (Editor), Nadin Martin (Editor), Nadine Martin (Editor) |
Publisher | Springer, Berlin |
Languages | English |
Product format | Paperback / Softback |
Released | 20.12.2020 |
EAN | 9789811591983 |
ISBN | 978-981-1591-98-3 |
No. of pages | 795 |
Dimensions | 155 mm x 43 mm x 235 mm |
Illustrations | XV, 795 p. 504 illus., 415 illus. in color. |
Series |
Lecture Notes in Mechanical En Lecture Notes in Mechanical Engineering |
Subject |
Natural sciences, medicine, IT, technology
> Technology
> Mechanical engineering, production engineering
|
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