Fr. 110.00

Mechanical Analysis of Electronic Packaging Systems

English · Paperback / Softback

Shipping usually within 3 to 5 weeks

Description

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"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

List of contents










Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

About the author










Stephen A. McKeown, Lockheed Martin Control Systems, Johnson City, New York.

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