Mechanical Analysis of Electronic Packaging Systems

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

List of contents

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

About the author

Stephen A. McKeown, Lockheed Martin Control Systems, Johnson City, New York.

Product details

• Authors: Mckeown, McKeown, Stephen A McKeown, Stephen A. Mckeown, McKeown Stephen A.
• Publisher: Taylor & Francis Ltd.
• Languages: English
• Product format: Paperback / Softback
• Released: 31.08.2019
• EAN: 9780367399818
• ISBN: 978-0-367-39981-8
• No. of pages: 376
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; TECHNOLOGY & ENGINEERING / Mechanical, TECHNOLOGY & ENGINEERING / Civil / General, TECHNOLOGY & ENGINEERING / Electronics / General, Electrical Engineering, environmental science, engineering & technology, Mechanical Engineering, Engineering: general, Electronics engineering, Environmental science, engineering and technology