Fundamentals of Electromigration-Aware Integrated Circuit Design

The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration's negative impact on circuit reliability.

List of contents

Introduction.- Fundamentals of Electromigration.- Integrated Circuit Design and Electromigration.- Mitigating Electromigration in Physical Design.- Summary and Outlook.

About the author

Jens Lienig is the director of the Institute of Electromechanical and Electronic Design at Dresden University of Technology, Germany. He received his Ph.D. in the field of computer-aided physical design of multi-chip modules and was employed as a researcher at University of Virginia, Charlottesville and Concordia University, Montreal. Afterwards he worked as project manager at Tanner Research, Inc. and Robert Bosch GmbH. His main research subjects are design of electronic systems and electronic design automation. He is a member of IEEE.

Matthias Thiele is a scientific assistant at Dresden University of Technology, Germany. He received his Ph.D. in the field of electromigration. Currently he works on the reliability of electronic and mechatronic systems.

Summary

The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.

Product details

• Authors: Jen Lienig, Jens Lienig, Matthias Thiele
• Publisher: Springer, Berlin
• Languages: English
• Product format: Paperback / Softback
• Released: 01.01.2018
• EAN: 9783030088118
• ISBN: 978-3-0-3008811-8
• No. of pages: 159
• Dimensions: 157 mm x 245 mm x 11 mm
• Weight: 279 g
• Illustrations: XIII, 159 p. 99 illus., 95 illus. in color.
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; B, Microprocessors, engineering, Circuits and Systems, Electronic Circuits and Devices, Electronic devices & materials, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Electronics engineering, Electronic circuits, Electronic Circuits and Systems, Electronics: circuits & components, Computer architecture & logic design, Processor Architectures