Inkjet-Configurable Gate Array - Towards Application Specific Printed Electronic Circuits

This thesis reports on an outstanding research advance in the development of Application Specific Printed Electronic (ASPE) circuits. It proposes the novel Inkjet-Configurable Gate Array (IGA) concept as a design-manufacturing method for the direct mapping of digital functions on top of new prefabricated structures.
The thesis begins by providing details on the generation of the IGA bulk, and subsequently presents Drop-on-Demand configurable methodologies for the metallization of IGAs. Lastly, it demonstrates IGAs' suitability for personalization and yield improvement, and reports on the integration of various circuits into IGA bulk. In addition to highlighting novel results, the thesis also offers a comprehensive introduction to printed electronics, from technology development, to design methods, tools and kits.

List of contents

Introduction.- Background Asic Design Methodologies.- State Of The Art.- DesignTechnology Interaction.- Inkjet-Configurable Gate Array (Iga).- Conclusion.

Summary

This thesis reports on an outstanding research advance in the development of Application Specific Printed Electronic (ASPE) circuits. It proposes the novel Inkjet-Configurable Gate Array (IGA) concept as a design-manufacturing method for the direct mapping of digital functions on top of new prefabricated structures.
 The thesis begins by providing details on the generation of the IGA bulk, and subsequently presents Drop-on-Demand configurable methodologies for the metallization of IGAs. Lastly, it demonstrates IGAs’ suitability for personalization and yield improvement, and reports on the integration of various circuits into IGA bulk. In addition to highlighting novel results, the thesis also offers a comprehensive introduction to printed electronics, from technology development, to design methods, tools and kits.

Product details

• Authors: Mohammad Mashayekhi
• Publisher: Springer, Berlin
• Languages: English
• Product format: Hardback
• Released: 01.01.2018
• EAN: 9783319721156
• ISBN: 978-3-31-972115-6
• No. of pages: 209
• Dimensions: 161 mm x 242 mm x 18 mm
• Weight: 455 g
• Illustrations: XV, 209 p. 165 illus., 129 illus. in color.
• Series: Springer Theses; Springer Theses
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; B, Schaltkreise und Komponenten (Bauteile), Konstruktion, Entwurf, engineering, Engineering Design, Circuits and Systems, Technical design, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Electronic circuits, Electronic Circuits and Systems, Electronics: circuits & components