SCALING & INTEGRATION OF HIGH-SPEED ELECTRON & OPTOMECHAN

Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.
In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.

Product details

• Authors: Magnus Willander & Hakan Pettersson
• Assisted by: Hakan Pettersson (Editor), Magnus Willander (Editor)
• Publisher: World Scientific
• Languages: English
• Product format: Hardback
• Released: 19.04.2017
• EAN: 9789813225398
• ISBN: 978-981-3225-39-8
• No. of pages: 150
• Dimensions: 175 mm x 250 mm x 13 mm
• Weight: 450 g
• Series: Selected Topics in Electronics; Selected Topics in Electronics and Systems; Selected Topics in Electronics
• Subject: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering