More than Moore Technologies for Next Generation Computer Design

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as "More than Moore" (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to "Moore's Law". Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

List of contents

Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.

About the author

Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.

Summary

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Product details

• Assisted by: Rasi O Topaloglu (Editor), Rasit O Topaloglu (Editor), Rasit O. Topaloglu (Editor)
• Publisher: Springer, Berlin
• Languages: English
• Product format: Paperback / Softback
• Released: 01.01.2016
• EAN: 9781493947102
• ISBN: 978-1-4939-4710-2
• No. of pages: 218
• Dimensions: 157 mm x 235 mm x 11 mm
• Weight: 395 g
• Illustrations: IX, 218 p. 116 illus., 63 illus. in color.
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; B, Microprocessors, engineering, Circuits and Systems, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Electronics engineering, Electronic circuits, Electronic Circuits and Systems, Computer architecture & logic design, Processor Architectures