Fr. 164.40

American Society of Mechanical Engineers (ASME), Avram Bar-Cohen, Allan D Kraus, Allan D. Kraus

Advances in Thermal Modeling of Electronic Components and Systems, Volume 2

English · Hardback

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Description

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

Product details

Authors	American Society of Mechanical Engineers (ASME)
Assisted by	Avram Bar-Cohen (Editor), Allan D Kraus (Editor), Allan D. Kraus (Editor)
Publisher	Life Raft Media Ltd

Languages	English
Product format	Hardback
Released	01.01.1990

EAN	9780791800157
ISBN	978-0-7918-0015-7
No. of pages	437
Dimensions	155 mm x 231 mm x 28 mm
Weight	771 g
Series	Advances in Thermal Modeling o Advances in Thermal Modeling o
Subject	Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering

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