Fr. 190.90

Leland Spangler

The Art and Science of Microsystem Packaging

English · Hardback

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Description

Covering the challenges faced by design engineers in microsystems packaging, this book details the variety of materials that can be used as well as the advantages and disadvantages of each. It places emphasis on materials, technologies, and assembly processes and guidelines that are being used in production and are production worthy. The reader is assumed to have general understanding of micromachined concepts and semiconductor fabrication technology.

Product details

Authors	Leland Spangler
Publisher	Springer London

Languages	English
Product format	Hardback
Released	01.04.2007

EAN	9780387489049
ISBN	978-0-387-48904-9
No. of pages	375
Series	Microsystems
Subject	Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering

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