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This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.
About the author
Prof. Nam-Young Kim received two Masters and two Ph.D. degrees from Dept. of Electronic Eng.,SUNY at Buffalo and M.Div. and D.C.E., Midwest University, U.S.A.Dr. Zorigt Chuluunbaatar received the B.S. degree in Electronic Eng. from Huree ICT University (Mongolia) in 2007, M.S. and Ph.D. degrees in Electronic Eng. from Kwangwoon Univ., Korea(ROK)
