Fr. 79.00

Variability Aware Statistical Timing Modelling Using SPICE Simulations

English, German · Paperback / Softback

Shipping usually within 2 to 3 weeks (title will be printed to order)

Description

Read more

As technology scaling enters into nanometer geometries, there is a significant increase in performance uncertainty of System-on-chip designs due to parametric variations. Process variability is posing an increasing challenge in timing analysis for designers. The traditional corner-based approach is not effective anymore and it will induce pessimism. Therefore, statistical timing analysis has become very important in overcoming the weakness of the traditional methods. By constructing statistical timing models for variations, chip performance and parametric yield will be more accurately predicted. In this work, variability aware statistical timing models of standard cells and system level interconnects are developed by using SPICE simulations, and statistical timing analysis flow and characterization automation are summarized.

About the author










Di Wang is a researcher at Microsoft Research. He received B.E. in computer science from Zhejiang University, M.S. in computer systems engineering from the Technical University of Denmark, and Ph.D. in computer science from Pennsylvania State University. His research work span the areas of computer systems, computer architecture and VLSI design.

Product details

Authors DI Wang
Publisher LAP Lambert Academic Publishing
 
Languages English, German
Product format Paperback / Softback
Released 30.04.2015
 
EAN 9783659405532
ISBN 978-3-659-40553-2
No. of pages 136
Subject Natural sciences, medicine, IT, technology > IT, data processing > Hardware

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.