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Informationen zum Autor McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide Klappentext Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics , Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book's full-color figures plus animations. Zusammenfassung The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies--completely updated. Inhaltsverzeichnis Introduction to Third Edition; Acknowledgments; Introduction to CD; Chapter 1. The Technical Introduction to the Third Edition; Chapter 2. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; Chapter 3. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; Chapter 4. Wire Bond Testing; Chapter 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding; Chapter 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability; Chapter 7. Cleaning to Improve Bondability and Reliability; Chapter 8. Mechanical Problems in Wire Bonding; Chapter 9. Advanced and Specialized Wire Bonding Technologies; Chapter 10. An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging; Chapter 11. Wire Bonding Process Modeling and Simulation; Glossary ; Bibliography ; Index ...
