Robust Design of Microelectronics Assemblies Against Mechanical - Effects of Temperature, Moisture, Mechanical Electrical Driving

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

List of contents

Temperature induced failureMoisture induced failureMechanical shock induced failureAdhesive interconnects and viscoelasticityConcluding remarksPrograms and macro filesTemperature induced failureMoisture induced failureMechanical induced failure

About the author

Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

Product details

• Authors: Y -W Mai, Y. -W Mai, Y.-W. Mai, E. H. Wong, E. H. Woon Wong, E.-H. Wong, E-H Wong
• Publisher: ELSEVIER SCIENCE BV
• Languages: English
• Product format: Hardback
• Released: 01.06.2015
• EAN: 9781845695286
• ISBN: 978-1-84569-528-6
• No. of pages: 482
• Series: Woodhead Publishing Series in Electronic and Optical Materials; Woodhead Publishing Series in Electronic and Optical Materials; Woodhead Publishing Series in; Woodhead Publishing Electronic
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; TECHNOLOGY & ENGINEERING / Electronics / General, Electronics engineering