Fr. 134.00

Recent Progress in the Mechanics of Defects

English · Paperback / Softback

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Description

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The International Symposium on Defect and Material Mechanics (ISDMM09) was the fourth international meeting of a series, following the workshops held at Kaiserslautern (2003), Symi (2005) and Aussois (2007), and was held in the alpine city of Trento, Italy, from July 6 to 9, 2009.
The Symposium brought together researchers in the areas of the mechanics of defects, in a broad sense: cracks, dislocations, inclusions, precipitates, phase boundaries, and shape optimization.
A select number of contributions based on the presentations given at the symposium are collected in this volume, which provides a reference source of the present state of development in the field of the mechanics of defects.
Previously published in the International Journal of Fracture 166:1-2 (2010).

List of contents

Preface, by D. Bigoni, L. Deseri; ORIGINAL PAPERS: On the convergence of 3D free discontinuity models in variational fracture, by F. Fraternali, M. Negri, M. Ortiz; Size and shape dependent steady-state pull-off force in molecular adhesion between soft elastic materials, by J. Wang, H. Gao; A numerical study of arterial media dissection Processes, by A. Ferrara, A. Pandolfi; Evolution equation of moving defects: dislocations and inclusions, by X. Markenscoff; Perturbation of mode III interfacial cracks, by A. Piccolroaz, G. Mishuris, A.B. Movchan; On path-independent integrals within the linear theory of elasticity, by R. Kienzler, L. Rohde, R. Schröder; Elasto-plastic materials with lattice defects modeled by second order deformations with non-zero curvature, by S. Cleja-Tigoiu; The role of electric field gradient in modeling elastic ferroelectrics, by V.K. Kalpakides, A.I. Arvanitakis, E.P. Hadjigeorgiou; The stress intensity near a stiffener disclosed by Photoelasticity, by G. Noselli, F. Dal Corso, D. Bigoni; Stationary straight cracks in quasicrystals, by E. Radi, P.M. Mariano; Dynamic mode-III interface crack in a bi-material strip, by G.S. Mishuris, N.V. Movchan, A.B. Movchan; Dual approach in non-linear fracture mechanics, by C. Stolz; On curved crack paths in finite strain fracture Mechanics, by H. Schütte; On a 3D micromechanical damage model, by C. Dascalu, A.M. Dobrovat, M. Tricarico; Fracture simulation offerroelectrics based on the phase field continuum and a damage variable, by B.-X. Xu, D. Schrade, D. Gross, R. Mueller; Effect of surface energy on the plastic behavior of crystalline thin films under plane strain constrained shear, by G.-Y. Huang, B. Svendsen.

Summary

The International Symposium on Defect and Material Mechanics (ISDMM09) was the fourth international meeting of a series, following the workshops held at Kaiserslautern (2003), Symi (2005) and Aussois (2007), and was held in the alpine city of Trento, Italy, from July 6 to 9, 2009.
 The Symposium brought together researchers in the areas of the mechanics of defects, in a broad sense: cracks, dislocations, inclusions, precipitates, phase boundaries, and shape optimization.
A select number of contributions based on the presentations given at the symposium are collected in this volume, which provides a reference source of the present state of development in the field of the mechanics of defects.
Previously published in the International Journal of Fracture 166:1-2 (2010).

Product details

Assisted by David Bigoni (Editor), Davide Bigoni (Editor), Deseri (Editor), Deseri (Editor), Luca Deseri (Editor)
Publisher Springer Netherlands
 
Languages English
Product format Paperback / Softback
Released 01.01.2014
 
EAN 9789401784375
ISBN 978-94-0-178437-5
No. of pages 237
Dimensions 196 mm x 255 mm x 16 mm
Weight 517 g
Illustrations VI, 237 p.
Subjects Natural sciences, medicine, IT, technology > Technology > Mechanical engineering, production engineering

B, engineering, Classical mechanics, Mathematical and Computational Engineering, Mechanical Engineering, Solid Mechanics, Mechanics, Mechanics, Applied, Engineering mathematics, Applied mathematics, Mathematical and Computational Engineering Applications, Maths for engineers

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