Reliability of Microtechnology - Interconnects, Devices and Systems

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.

List of contents

Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.

Summary

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.

Product details

• Authors: Cristina Andersson, Joha Liu, Johan Liu, James E. Morris, Oll Salmela, Olli Salmela, Jussi Sarkka, Jussi et al Sarkka, Per-Erik Tegehall
• Publisher: Springer, Berlin
• Languages: English
• Product format: Paperback / Softback
• Released: 01.01.2014
• EAN: 9781489982117
• ISBN: 978-1-4899-8211-7
• No. of pages: 204
• Dimensions: 172 mm x 12 mm x 236 mm
• Weight: 343 g
• Illustrations: XIII, 204 p.
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; B, engineering, quality control, Industrial and Production Engineering, Optical and Electronic Materials, reliability, Other manufacturing technologies, Nanotechnology, Electronic materials, Electronic devices & materials, Optical Materials, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Industrial safety, Quality Control, Reliability, Safety and Risk, Reliability engineering, Microsystems and MEMS, Nanotechnology and Microengineering