Advances in Cmp Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.
Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.
Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

List of contents

Chapter 1: Introduction
Chapter 2: Device fabrication with a silicon crystal substrate
Chapter 3: Ultra-precision technology - taking silicon single crystal as an example
Chapter 4: Applications of ultra-precision CMP in device processes
Chapter 5: The future of processing technology
Chapter 6: Progress of the semiconductor and silicon industries
Chapter 7: Summary

Summary

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.

Product details

• Authors: Toshiro Doi, Toshiro (EDT)/ Marinescu Doi
• Assisted by: Toshiro Doi (Editor), Toshiro (Professor of Manufacturing Processes Doi (Editor), Syuhei Kurokawa (Editor), Ioan D. Marinescu (Editor), Ioan D. (Professor and Director Marinescu (Editor), Ioan D. (University of Toledo Marinescu (Editor)
• Publisher: ELSEVIER SCIENCE BV
• Languages: English
• Product format: Hardback
• Release: 05.12.2011, delayed
• EAN: 9781437778595
• ISBN: 978-1-4377-7859-5
• No. of pages: 496
• Series: William Andrew Publishing; William Andrew Publishing
• Subject: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering