Fr. 134.00

Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design

English · Paperback / Softback

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Description

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Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design discusses new approaches to better timing-closure and manufacturability of DSM Integrated Circuits. The key idea presented is the use of regular circuit and interconnect structures such that area/delay can be predicted with high accuracy. The co-design of structures and algorithms allows great opportunities for achieving better final results, thus closing the gap between IC and CAD designers. The regularities also provide simpler and possibly better manufacturability.
In this book we present not only algorithms for solving particular sub-problems but also systematic ways of organizing different algorithms in a flow to solve the design problem as a whole. A timing-driven chip design flow is developed based on the new structures and their design algorithms, which produces faster chips in a shorter time.

List of contents

Preliminaries.- Circuit Structures.- Block-Level Placement and Routing.- The Module-Based Design Flow.- Conclusion.

Summary

Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design discusses new approaches to better timing-closure and manufacturability of DSM Integrated Circuits. The key idea presented is the use of regular circuit and interconnect structures such that area/delay can be predicted with high accuracy. The co-design of structures and algorithms allows great opportunities for achieving better final results, thus closing the gap between IC and CAD designers. The regularities also provide simpler and possibly better manufacturability.
In this book we present not only algorithms for solving particular sub-problems but also systematic ways of organizing different algorithms in a flow to solve the design problem as a whole. A timing-driven chip design flow is developed based on the new structures and their design algorithms, which produces faster chips in a shorter time.

Product details

Authors Robert K Brayton, Robert K. Brayton, Fa Mo, Fan Mo
Publisher Springer, Berlin
 
Languages English
Product format Paperback / Softback
Released 16.10.2013
 
EAN 9781475779349
ISBN 978-1-4757-7934-9
No. of pages 242
Dimensions 155 mm x 14 mm x 235 mm
Weight 400 g
Illustrations XI, 242 p.
Subject Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering

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