Fr. 175.20

INTRODUCTION TO MICROMECHANICS & NANOMECHANICS (2ND ED)

English · Paperback / Softback

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Description

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This book presents a systematic treatise on micromechanics and nanomechanics, which encompasses many important research and development areas such as composite materials and homogenizations, mechanics of quantum dots, multiscale analysis and mechanics, defect mechanics of solids including fracture and dislocation mechanics, etc.
In this second edition, some previous chapters are revised, and some new chapters added - crystal plasticity, multiscale crystal defect dynamics, quantum force and stress, micromechanics of metamaterials, and micromorphic theory.
The book serves primarily as a graduate textbook and intended as a reference book for the next generation of scientists and engineers. It also has a unique pedagogical style that is specially suitable for self-study and self-learning for many researchers and professionals who do not have time attending classes and lectures.

List of contents

Statistical Mechanics and Mathematics in Homogenizations, Material Properties of Composite Materials and Heterogeneous Media; Variational Calculus and Applied Functional Analysis on Material Optimization; Defect Mechanics including Dislocation Dynamics, Fracture Mechanics, Crystal Plasticity, Configurational Mechanics and Multiscale Crystal Defect Dynamics; Asymptotic Homogenization and Micromechanics of Metamaterials; Quantum Force and Stress, Multiscale Modeling and Simulation, and Applications to Quantum Dots and Thin Films; Surface Mechanics Theory, Such Gurtin-Murdoch Model; Micromorphic Theory and Strain Gradient Theory.

Product details

Authors Shaofan Li, Shaofan Li & Gang Wang, Gang Wang
Publisher World Scientific
 
Languages English
Product format Paperback / Softback
Released 28.02.2018
 
EAN 9789814436762
ISBN 978-981-4436-76-2
No. of pages 660
Dimensions 170 mm x 244 mm x 35 mm
Weight 1120 g
Subject Natural sciences, medicine, IT, technology > Technology > Mechanical engineering, production engineering

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