Fr. 166.00

VLSI-SoC: From Systems to Silicon - IFIP TC10/ WG 10.5 Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC2005), October 17-19, 2005, Perth, Australia

English · Paperback / Softback

Shipping usually within 6 to 7 weeks

Description

Read more

This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field of mic- electronics design. The current trend toward increasing chip integ- tion and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SOC conferences aim to address these exciting new issues. The 2005 edition of VLSI-SoC maintained the traditional structure, which has been successful at the previous VLSI-SOC conferences. The quality of submissions (107 papers from 26 countries) made the selection process difficult, but finally 63 papers and 25 posters were accepted for presentation in VLSI-SoC 2005. Out of the 63 full papers presented at the conference, 20 were chosen by a selection committee to have an extended and revised version included in this book. These selected papers came from Australia, Brazil, France, Germany, Italy, Korea, Portugal, Sweden, Switzerland, United Kingdom and the United States of America. x Preface

List of contents

Molecular Electronics - Devices and Circuits Technology.- Improving DPA Resistance of Quasi Delay Insensitive Circuits Using Randomly Time-shifted Acknowledgment Signals.- A Comparison of Layout Implementations of Pipelined and Non-Pipelined Signed Radix-4 Array Multiplier and Modified Booth Multiplier Architectures.- Defragmentation Algorithms for Partially Reconfigurable Hardware.- Technology Mapping for Area Optimized Quasi Delay Insensitive Circuits.- 3D-SoftChip: A Novel 3D Vertically Integrated Adaptive Computing System.- Caronte: A methodology for the Implementation of Partially dynamically Self-Reconfiguring Systems on FPGA Platforms.- A Methodology for Reliability Enhancement of Nanometer-Scale Digital Systems Based on a-priori Functional Fault- Tolerance Analysis.- Issues in Model Reduction of Power Grids.- A Traffic Injection Methodology with Support for System-Level Synchronization.- Pareto Points in SRAM Design Using the Sleepy Stack Approach.- Modeling the Traffic Effect for the Application Cores Mapping Problem onto NoCs.- Modular Asynchronous Network-on-Chip: Application to GALS Systems Rapid Prototyping.- A Novel MicroPhotonic Structure for Optical Header Recognition.- Combined Test Data Selection and Scheduling for Test Quality Optimization under ATE Memory Depth Constraint.- On-chip Pseudorandom Testing for Linear and Nonlinear MEMS.- Scan Cell Reordering for Peak Power Reduction during Scan Test Cycles.- On The Design of A Dynamically Reconfigurable Function-Unit for Error Detection and Correction.- Exact BDD Minimization for Path-Related Objective Functions.- Current Mask Generation: an Analog Circuit to Thwart DPA Attacks.- A Transistor Placement Technique Using Genetic Algorithm and Analytical Programming.

Summary

This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field of mic- electronics design. The current trend toward increasing chip integ- tion and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SOC conferences aim to address these exciting new issues. The 2005 edition of VLSI-SoC maintained the traditional structure, which has been successful at the previous VLSI-SOC conferences. The quality of submissions (107 papers from 26 countries) made the selection process difficult, but finally 63 papers and 25 posters were accepted for presentation in VLSI-SoC 2005. Out of the 63 full papers presented at the conference, 20 were chosen by a selection committee to have an extended and revised version included in this book. These selected papers came from Australia, Brazil, France, Germany, Italy, Korea, Portugal, Sweden, Switzerland, United Kingdom and the United States of America. x Preface

Product details

Assisted by Ada Osseiran (Editor), Adam Osseiran (Editor), Hans-Joerg Pfleiderer (Editor), Ricardo Reis (Editor)
Publisher Springer, Berlin
 
Languages English
Product format Paperback / Softback
Released 22.10.2010
 
EAN 9781441944672
ISBN 978-1-4419-4467-2
No. of pages 344
Dimensions 156 mm x 18 mm x 234 mm
Weight 539 g
Illustrations X, 344 p.
Series IFIP Advances in Information and Communication Technology
IFIP Advances in Information and Communication Technology
IFIP International Federation for Information Processing
Subjects Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering

C, computer science, Circuits and Systems, Electronic circuits, Electronic Circuits and Systems

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.