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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
List of contents
Preface; Materials Research Society symposium proceedings; Part I. Chemical and Di Water Consumption: 1. In situ monitoring of HF reprocessing in an industrial scale A. J. Reddy, G. J. Norga, A. S. Park, A. L. Smith, J. Michel, L. C. Kimerling, B. Parekh, J.-H. Shyu and E. Deane; 2. Anhydrous HF processing as an alternative to HF/water processes J. Staffa, P. Roman, K. Chang, K. Torek and J. Ruzyllo; 3. Minimization of DI water consumption in wet clean rinse tanks J. Cook; 4. The implementation of dilute chemistries in semiconductor manufacturing Ron Sanders, Fuyu Lin and Pat Schay; Part II. Hazardous Gases: 5. PFC emission control options for plasma processing tools: a current assessment M. T. Mocella; 6. Perhalogenated organic byproducts from plasma etching processes and their effects on human health and environmental impact S. Bauer and I. Wolff; 7. Environmental issues of perfluorocompounds in the semiconductor industry Jeffrey D. Williams; 8. Effectiveness of an inwardly fired burner on abatement of PFCs A. M. Pierce and J. Van Gompel; 9. Gas stream analysis and PFC recovery in a semiconductor process J. A. B. Van Hoeymissen, M. Daniels, N. Anderson, W. Fyen and M. Heyns; 10. An integrated approach for the safe handling of hydrides J. R. Shealy, B. Butterfield, D. T. Emerson, K. L. Whittingham, B. L. Pitts and R. R. Bland; 11. Plasma etching of silicon dioxide and silicon nitride with nonperfluorocompound chemistries: trifluoroacetic anhydride and Iodofluorocarbons Simon M. Karecki, Laura C. Pruette and L. Rafael Reif; Part III. Equipment and Process Optimization for ESH: 12. Next generation processes and equipment that lead to positive environment, safety, and health impacts Phyllis Pei and H. Ray Kerby; 13. Parallel downflow rinse: water saving technology in water rinse Y. Hiratsuka and N. Fujikawa; 14. A technique for measuring slurry-flow dynamics during chemical mechanical polishing J. Coppeta, C. Rogers, A. Philipossian and F. Kaufman; 15. A plasma reactor for solid waste treatment on PECVD production systems S. Raoux, M. A. Fodor, W. N. Taylor, D. Cheung and K. Fairbairn; 16. Measurement of arsenic emission from doped Czochraiski silicon crystal growing operation D. Sinha, C. Carlson, Andy Homyak and Elias Hunter; Part IV. Novel Materials for ESH: 17. Chlorine precursors for grate oxidation processes M. J. McGeary, P. W. Mertens, B. Vermeire, M. Heyns, H. Sprey, A. Lubbers and M. Schaekers; 18. Photoresist polymer mask formed from aqueous phase via polymerization in a two-dimensional surfactant template P. D. Newman, G. K. Newman and J. H. Harwell; 19. An integrated chemical-microbiological approach for the disposal of waste thin-film cadmium telluride photovoltaic modules K. M. Paknikar, J. M. Rajwade, A. V. Pethkar, D. J. Goyal, P. G. Bilurkar and N. V. Mate; 20. Point-of-use silicon sources for CVD D. A. Saulys, S. A. Safvi, N. Pauly, J. A. Dopke, B. R. Preston, D. F. Gaines and T. F. Kuech; 21. Safe precursor gas for broad replacement of SiH4 in plasma processes employed in integrated circuit production M. J. Loboda, J. A. Seifferly, C. M. Grove and R. F. Schneider; Author index; Subject index.
Summary
This book provides an overview of the available scientific information on environmentally benign IC production. A broad range of topics is addressed including work on resource reduction for chemicals, gases and DI water, reuse or recycling of chemicals, waste treatment strategies, environmentally friendly alternative technologies and analytical technologies for environmental studies.
