Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

List of contents

Part I. Low-k Dielectrics I; Part II. Low-k Dielectrics II; Part III. Poster Session: Interconnects; Part IV. Metalization I; Part V. Metallization II; Part VI. Reliability; Part VII. Emerging Interconnect Technologies; Part VIII. Joint Session: Interconnect and Packaging; Author index; Subject index.

Summary

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Product details

• Assisted by: M. Gall (Editor), Martin Gall (Editor), A. Grill (Editor), Alfred Grill (Editor), Alfred (IBM T J Watson Research Center Grill (Editor), Junichi Koike (Editor), Junichi (Tohoku University Koike (Editor), F. Lacopi (Editor), Francesca Lacopi (Editor), Takamasa Usui (Editor)
• Publisher: Cambridge University Press
• Languages: English
• Product format: Hardback
• Released: 18.11.2009
• EAN: 9781605111292
• ISBN: 978-1-60511-129-2
• No. of pages: 204
• Dimensions: 157 mm x 235 mm x 16 mm
• Weight: 454 g
• Series: MRS Proceedings; MRS Proceedings
• Subject: Natural sciences, medicine, IT, technology > Technology > Miscellaneous