Chemical-Mechanical Polishing - Fundamentals and Challenges

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

List of contents

Part I. Overview and Oxide Polishing; Part II. Pads and Related Issues; Part III. Metal Polishing - W and AI; Part IV. Copper Polishing and Related Issues; Part V. CMP Modeling and Fluid Flow; Part VI. Particle Adhesion and Post-polish Cleaning; Author index; Subject index.

Summary

This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included.

Product details

• Assisted by: S. V Babu (Editor), S. V. Babu (Editor), Suryadevara V. Babu (Editor), S. Danyluk (Editor), M. Krishnan (Editor), M. I. Krishnan (Editor), Manabu Tsujimura (Editor)
• Publisher: Cambridge University Press
• Languages: English
• Product format: Hardback
• Released: 10.02.2000
• EAN: 9781558994737
• ISBN: 978-1-55899-473-7
• No. of pages: 296
• Dimensions: 157 mm x 235 mm x 21 mm
• Weight: 582 g
• Series: MRS Proceedings; Materials Research Society Sym; Materials Research Society Sym
• Subject: Natural sciences, medicine, IT, technology > Technology > Chemical engineering