Fr. 277.00

Dielectric Materials for Wireless Communication

English · Hardback

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Description

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About 5000 papers have been published and more than 1000 patents filed in the area of dielectric resonators and related technologies. This book brings the data and science of these materials together. It includes the factors affecting the dielectric properties and measurement of dielectric electric properties. It is intended for engineers.

List of contents

Foreword by Prof. Neil Alford, F R Eng. Imperial College London
1. Introduction
2. Measurement of microwave dielectric properties and factors affecting them
3. Microwave dielectric materials in the BaO-TiO2 system
4. (Zr,Sn)TiO4 ceramics
5. Tungsten bronze type materials
6. ABO3 type perovskites
7. A(B'1/2B”1/2)O3 complex perovskites
8. A(B'1/3B”2/3)O3 complex perovskites
9. Cation deficient perovskites
10. A(A1/4B2/4C1/4)O3 (A=Ca,Mg, Zn, Sr, Co.., B=Nb,Ta) type materials
11. Alumina, titania and other materials
12. Low Temperature Cofired Ceramics (LTCC)
13. Tailoring the properties of low loss dielectrics
14. Conclusion

About the author

Dr. M T Sebastian is currently Deputy Director, National Institute for Interdisciplinary Science and Technology at Trivandrum in India. He obtained his Ph.D. in Physics from Banaras Hindu University in 1983. He taught physics at Cochin University of Science & Technology during 1984-87. He was an Alexander Von Humboldt Fellow in Germany and Nokia Visiting Fellow in Finland. He has done extensive researches in USA, UK, France, Germany, Australia, Czech Republic, Australia, Japan and Finland. He has co-authored the book “Random non-random and periodic faulting in crystals” published by Gordon & Breach Science publishers (1994). He has published more than 160 research papers in international refereed journals and possesses several patents. His research interests are microwave ceramic dielectric resonators, perovskites electrode materials, crystal growth and defect characterization, X-ray scattering from disordered structures, electronic packaging materials.

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