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Nanotechnology and microengineering are among the top priority research areas for the US and Europe. This text provides coverage of all aspects of the attempt to build functional devices at a molecular size.
List of contents
Preface.
Acknowledgements.
PART I: INTRODUCTION.
1. Introduction.
2. Micrometrology and Materials Characterization.
3. Simulation of Microfabrication Processes.
PART II: MATERIALS .
4. Silicon.
5. Thin-Film Materials and Processes.
6. Epitaxy.
7. Thin-film Growth and Structure.
PART III: BASIC PROCESSES.
8. Pattern Generation.
9. Optical Lithography.
10. Lithographic Patterns.
11. Etching.
12. Wafer Cleaning and Surface Preparation.
13. Thermal Oxidation.
14. Diffusion.
15. Ion Implantation.
16. CMP: Chemical-Mechanical Polishing.
17. Bonding and Layer Transfer.
18. Molding and Stamping.
PART IV: STRUCTURES.
19. Self-aligned Structures.
20. Plasma-etched Structures.
21. Wet-etched Structures.
22. Sacrificial Structures.
23. Structures by Deposition.
PART V: INTEGRATION.
24. Process Integration.
25. CMOS Transistor Fabrication.
26. Bipolar Technology.
27. Multilevel Metallization.
28. MEMS Process Integration.
29. Processing on Non-silicon Substrates.
PART VI: TOOLS.
30. Process for Microfabrication.
31. Tools for Hot Process.
32. Vacuum and Plasmas.
33. Tools for CVD and Epitaxy.
34. Integrated Processing.
PART VII: MANUFACTURING.
35. Cleanrooms.
36. Yield.
37. Wafer Fab.
PART VIII: FUTURE.
38. Moore's Law.
39. Microfabrication at Large.
Appendix A: Comments and Hints to Selected Problems.
Appendix B: Constants and Conversion Factors.
Index.
