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The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging.
Über den Autor / die Autorin
Gerald Gerlach hat an der Technischen Universität Dresden Elektrotechnik studiert.§Nach seiner Promotion zum Doktor Ingenieur 1987 hat er 1991 habilitiert und ist seit 1993 Professor an der Fakultät Elektrotechnik der Technischen Universität Dresden. Er war mehrere Jahre Sprecher des Graduiertenkollegs "Sensorik" an der TU Dresden und ist seit 1996 Direktor des Instituts für Festkörperelektronik. Seit 2007 ist er Vorsitzender der VDI/VDE-Gesellschaft für Mess- und Automatisierungstechnik. Als Mitglied des wissenschaftlichen Beirats der Zeitschrift Technisches Messen und als langjähriger Fachgutachter der DFG und Vorsitzender des Arbeitskreises der Hochschullehrer für Messtechnik (AHMT) hat er nicht nur seiner Arbeit Inspiration geben können. Seit 2006 ist er Associate Editor des IEEE Sensors Journals.
Zusammenfassung
This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.
