Materials for Advanced Packaging

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

List of contents

3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.

Summary

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Product details

• Assisted by: Danie Lu (Editor), Daniel Lu (Editor), P Wong (Editor), P Wong (Editor), C. P. Wong (Editor), C.P. Wong (Editor)
• Publisher: Springer, Berlin
• Languages: English
• Product format: Hardback
• Released: 05.01.2009
• EAN: 9780387782188
• ISBN: 978-0-387-78218-8
• No. of pages: 724
• Dimensions: 162 mm x 43 mm x 241 mm
• Weight: 1342 g
• Illustrations: XII, 724 p. 300 illus.
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; C, Chemistry and Materials Science, Metals technology / metallurgy, Optical and Electronic Materials, Nanotechnology, Metals, Metallic Materials, Metals and Alloys, Electronic materials, Optical Materials, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Electronics engineering