Fr. 45.90

Doping Engineering for Front-End Processing: Volume 1070

English · Paperback / Softback

Shipping usually within 3 to 5 weeks

Description

Read more










Materials scientists, silicon technologists and TCAD researchers come together in this book to share experimental results and physical models, discuss achievements and challenges, and identify key issues for future research in this field. The volume focuses on many aspects related to doping of semiconductors (Si, SiGe and Ge) for device fabrication, and explores areas for single-gate as well as multi-gate devices with planar and vertical architectures. Surface properties, coverage, bonding saturation and passivation, and annealing ambient are also discussed.

List of contents










Preface; Part I. Ultra Shallow Junctions I; Part II. Shallow Junction Contacting; Part III. Poster Session; Part IV. Ultra Shallow Junctions II; Part V. Solid Phase Epitaxial Regrowth; Part VI. Modeling and Simulation; Author index; Subject index.

Product details

Authors B. J. Pawlak, B. J. Pelaz Pawlak
Assisted by M. Law (Editor), Law M. (Editor), B. J. Pawlak (Editor), Pawlak B. J. (Editor), M. L. Pelaz (Editor), Pelaz M. L. (Editor), Surugo K. (Editor)
Publisher Cambridge University Press ELT
 
Languages English
Product format Paperback / Softback
Released 05.06.2014
 
EAN 9781107408548
ISBN 978-1-107-40854-8
No. of pages 336
Series MRS Proceedings
MRS Proceedings
Subjects Natural sciences, medicine, IT, technology > Technology > Miscellaneous

Materials science, TECHNOLOGY & ENGINEERING / Materials Science / General, Electronic devices and materials, Semi-conductors & super-conductors

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.