Disponibiltà
Versione linguistica
Novità
Categoria
Forma del prodotto
Autori
prezzo massimo
CHF

Risultato ricerca (Wspc Advanced Integration and)

Christopher Bailey, Bailey Christopher, Hua Lu, Stoyan Stoyanov, Stoyanov Stoyan - Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability
Christopher Bailey, Bailey Christopher, Hua Lu, Stoyan Stoyanov, Stoyanov Stoyan Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability Inglese 28.02.2027 Copertina rigida CHF 206.00 3-5 settimane
Ali Shakouri, Je-hyeong Bahk, Je-hyeong (Univ Of Cincinnati Bahk, Je-Hyeong Bahk, Kazuaki Yazawa, … - Thermoelectric Energy Conversion Devices And Systems
Ali Shakouri, Je-hyeong Bahk, Je-hyeong (Univ Of Cincinnati Bahk, Je-Hyeong Bahk, Kazuaki Yazawa, … Thermoelectric Energy Conversion Devices And Systems Inglese 31.03.2021 Copertina rigida CHF 196.00 3-5 settimane
Lee Yung-cheng, Yu-Ting Cheng & Ramesh Ramadoss Y C Lee, Yu-ting Cheng, Y C Lee, Y. C. Lee, … - Mems Packaging
Lee Yung-cheng, Yu-Ting Cheng & Ramesh Ramadoss Y C Lee, Yu-ting Cheng, Y C Lee, Y. C. Lee, … Mems Packaging Inglese 31.12.2019 Copertina rigida CHF 220.00 3-5 settimane
Sandborn Peter, Peter Sandborn, Peter Sandborn, Sandborn Peter - Cost Analysis Of Electronic Systems
Sandborn Peter, Peter Sandborn, Peter Sandborn, Sandborn Peter Cost Analysis Of Electronic Systems Inglese 03.02.2017 Copertina rigida CHF 286.00 3-5 settimane
Karl J L Geisler & B Madhusudan Iyengar, Bahgat G Sammakia, Karl J L Geisler, Karl J. L. Geisler, Madhusudan Iyengar, … - Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
Karl J L Geisler & B Madhusudan Iyengar, Bahgat G Sammakia, Karl J L Geisler, Karl J. L. Geisler, Madhusudan Iyengar, … Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research Inglese 23.10.2014 Copertina rigida CHF 240.00 3-5 settimane
Ki Jin Han, Han Ki Jin, Swaminathan Madhavan, Madhavan Swaminathan & Ki Jin Han, Madhavan Swaminathan, … - Design And Modeling For 3d Ics And Interposers
Ki Jin Han, Han Ki Jin, Swaminathan Madhavan, Madhavan Swaminathan & Ki Jin Han, Madhavan Swaminathan, … Design And Modeling For 3d Ics And Interposers Inglese 24.12.2013 Copertina rigida CHF 196.00 3-5 settimane
Sandborn Peter, Peter Sandborn, Peter Sandborn, Sandborn Peter - Cost Analysis Of Electronic Systems
Sandborn Peter, Peter Sandborn, Peter Sandborn, Sandborn Peter Cost Analysis Of Electronic Systems Inglese 21.12.2012 Copertina rigida CHF 226.00 3-5 settimane