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Silicon Microchannel Heat Sinks
Theories and Phenomena

Inglese · Copertina rigida

Spedizione di solito entro 6 a 7 settimane

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There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Info autore










Professor Felix Wong is at present the Adjunct Professor at the University of New South Wales. He was the past Professor and Medical Director of Liverpool Hospital in Sydney, Australia. He had contributed to medical education in Asia Pacific Countries over the past 30 years. In recognition of his contributions to teaching, he received many awards and honors. In 2009, he received the Endos Award in Medical Science and Technology, China, for his excellent achievement in Endoscopic surgery. In 2017, he was granted Lin Qiaozhi Cup by the Chinese Obstetricians and Gynecologists Association (COGA) to recognize his significant contribution to obstetrics and gynecology in China. In 2017, he was honored by Lifetime Achievements Award by Asia-Pacific Association for Gynecologic Endoscopy and Minimally Invasive Therapy (APAGE). In 2018, he was awarded by the European Society for Gynecological Endoscopy (ESGE) for Outstanding Contribution Award. Professor Wong had edited 12 medical booksand had published more than 200 papers in local and international journals. He is currently the Chairman of the China-Asia Pacific Association of Minimally Invasive Gynecologic Oncologists (CA-AMIGO) and Foundation Chairman of China-Australia-Asia Pacific Forum of Minimally Invasive Surgery, and Vice President of the World Association of Chinese Obstetricians and Gynecologists.

Professsor Wong had edited 14 medical books and had published more than 200 papers in local and international journals. He retired from the university in 2010. Despite his unique endoscopic experience, he continues to contribute towards the development of HIFU education and services in China and Asia Pacific Areas.


Professor Lian Zhang graduated from Chongqing Medical University in 1987, studied in UCSD in 1998, and, after returning to China in 2004, worked in the Oncology Center of the Second Hospital Affiliated to Chongqing Medical University. He was one of the chief researchersworking to develop HIFU (high-intensity focused ultrasound) system. He was in charge of (or participated in) multiple scientific research projects. He was awarded multiple city-level and national-level scientific awards.


Over the last 10 years, he was at CIRSE, WCIO, SIUMB, PARIS, and among others, as an invited speaker. Prof. Lian Zhang's research areas and interests extend to anatomy, molecular biology, molecular genealogy, oncology, etc. He has published more than 80 papers in the peered review journals such as Acta Obstet Gynecol Scand., BJOG., Int J Gynaecol Obstet. Circulation, Journal of Clinical Investigation, Radiology, European Radiology, European Journal of Radiology, American Journal of Roentgenology, Ultrasounics Sonochemistry, International Journal of Hyperthermia and Medicine.


He is now responsible for training HIFU surgeons or physicians worldwide. He is currently the Secretary General of the International Society of Minimally Invasiveand Virtual Surgery, the Secretary General of the Minimally Invasive and Noninvasive Medical Committee of Chinese Medical Doctor Association. He serves as a section editor of the International Journal of Hyperthermia.


Professor Zhibiao WANG, MD/Ph.D, Professor of ObGyn and Biomedical Engineering, Ph.D. student supervisor, Senior Consultant of ObGyn, Chongqing Medical University; Director of the National Engineering Research Center of Ultrasound Medicine (NERCUM) and the State Key Laboratory of Ultrasound in Medicine and Engineering, respectively; Council member of the International Society of Minimally Invasive and Virtual Surgery (ISMIVS). Professor Wang is the Principal Investigator of the research grant awarded by the National Key Basic Research and Development Program (973 Program) in 2010 and the special fund for the Development of major Scientific Research Equipment awarded by the National Natural Science Foundation of China. He was the recipient of the National Science Fund for Distinguished Young Scholars, the second p


Riassunto

There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Dettagli sul prodotto

Autori Lian Zhang, Thomas W. Kenny, Kenneth E. Goodson, Lia Zhang, Kenneth Goodson, Thomas W Kenny, Kenneth E Goodson
Editore Springer, Berlin
 
Contenuto Libro
Forma del prodotto Copertina rigida
Data pubblicazione 04.12.2003
Categoria Scienze naturali, medicina, informatica, tecnica > Tecnica > Elettronica, elettrotecnica, telecomunicazioni
 
EAN 9783540401810
ISBN 978-3-540-40181-0
Numero di pagine 141
Illustrazioni IX, 141 p. 96 illus., 4 illus. in color.
Altezza (della confezione) 23.5 cm
Peso (della confezione) 354 g
 
Serie Microtechnology and MEMS
Microtechnology and MEMS
Categorie B, engineering, Condensed Matter Physics, Condensed matter, Materials / States of matter, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Engineering: general, Engineering, general, Technology and Engineering
 

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