MEMS Reliability

The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it.
MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

Riassunto

The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it.
MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

Dettagli sul prodotto

• Autori: Mark G. da Silva, Allyson Hartzell, Mark da Silva, Allyson L. Hartzell, Mark G. da Silva, Herbert R. Shea, Herbert R Shea, Allyson L Hartzell, Mark G Da Silva, Mark da Silva, Herbert Shea
• Editore: Springer, Berlin
• Contenuto: Libro
• Forma del prodotto: Copertina rigida
• Data pubblicazione: 30.11.2010
• Categoria: Scienze naturali, medicina, informatica, tecnica > Tecnica > Elettronica, elettrotecnica, telecomunicazioni
• EAN: 9781441960177
• ISBN: 978-1-4419-6017-7
• Numero di pagine: 291
• Illustrazioni: XIII, 291 p.
• Dimensioni (della confezione): 15.6 x 2.4 x 24.3 cm
• Peso (della confezione): 612 g
• Serie: MEMS Reference Shelf; Microtechnology and MEMS; MEMS Reference Shelf; Microtechnology and MEMS
• Categorie: B, engineering, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Failure mechanisms, packaging and testing, process development and characterization