CHF 475.00

Advances in Rapid Thermal and Integrated Processing

English · Hardback

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Description

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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Summary

Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995

Product details

Assisted by F Roozeboom (Editor), Roozeboom (Editor), F. Roozeboom (Editor)
Publisher Springer Netherlands
 
Content Book
Product form Hardback
Publication date 26.06.2009
Subject Natural sciences, medicine, IT, technology > Physics, astronomy > Atomic physics, nuclear physics
Non-fiction book > Nature, technology > Astronomy: general, reference works
 
EAN 9780792340119
ISBN 978-0-7923-4011-9
Pages 566
Illustrations XII, 566 p.
Dimensions (packing) 16.5 x 23.6 x 3.7 cm
Weight (packing) 989 g
 
Series NATO Science Series E: (Closed > 318
NATO Science Series E > Vol.318
NATO Science Series E: > 318
 

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