CHF 135.00

Processor and System-on-Chip Simulation

English · Hardback

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Description

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Simulation of computer architectures has made rapid progress recently. The primary application areas are hardware/software performance estimation and optimization as well as functional and timing verification. Recent, innovative technologies such as retargetable simulator generation, dynamic binary translation, or sampling simulation have enabled widespread use of processor and system-on-chip (SoC) simulation tools in the semiconductor and embedded system industries. Simultaneously, processor and SoC simulation is still a very active research area, e.g. what amounts to higher simulation speed, flexibility, and accuracy/speed trade-offs.This book presents and discusses the principle technologies and state-of-the-art in high-level hardware architecture simulation, both at the processor and the system-on-chip level.

Summary

Simulation of computer architectures has made rapid progress recently. The primary application areas are hardware/software performance estimation and optimization as well as functional and timing verification. Recent, innovative technologies such as retargetable simulator generation, dynamic binary translation, or sampling simulation have enabled widespread use of processor and system-on-chip (SoC) simulation tools in the semiconductor and embedded system industries. Simultaneously, processor and SoC simulation is still a very active research area, e.g. what amounts to higher simulation speed, flexibility, and accuracy/speed trade-offs.

This book presents and discusses the principle technologies and state-of-the-art in high-level hardware architecture simulation, both at the processor and the system-on-chip level.

Product details

Assisted by Raine Leupers (Editor), Temam (Editor), Temam (Editor), Olivier Temam (Editor), Rainer Leupers (Editor)
Publisher Springer, Berlin
 
Content Book
Product form Hardback
Publication date 28.04.2011
Subject Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communication
 
EAN 9781441961747
ISBN 978-1-4419-6174-7
Pages 345
Illustrations XIII, 345 p.
Dimensions (packing) 15.5 x 23.5 cm
Weight (packing) 649 g
 
Subjects Simulation, B, Computer-Aided Design (CAD), Embedded Systems, Modeling, engineering, Circuits and Systems, Computer-Aided Engineering (CAD, CAE) and Design, Computer-aided engineering, Electronic circuits, Electronic Circuits and Systems, Semiconductor, Electronic Design Automation, design automation, system on chip (SoC)
 

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