CHF 300.00

High Temperature Fracture Mechanics

English · Hardback

Shipping usually within 2 to 3 weeks

This item cannot be returned.

Description

Read more










This book systematically explains the mechanics of fracture phenomena, focusing on cracking under high temperature conditions. One of the defining characteristics of high temperature fracture is creep, a phenomenon where deformation progresses over time, eventually leading to failure.


About the author










Takayuki Kitamura is an emeritus professor at Kyoto University, Japan, and has a distinguished career spanning several prestigious institutions and roles. He served as a researcher at the Central Research Institute of Electric Power Industry, Japan, from 1979 to 1984, and as an invited researcher at NASA Lewis Research Center from 1987 to 1988. Dr. Kitamura held the position of professor at Kyoto University from 1998 to 2020 and as a specially appointed professor from 2023 to 2024. His administrative contributions include holding the positions of vice president (2007-2008) and executive vice president (2020-2023) at Kyoto University. He was also a member of the Science Council of Japan from 2008 to 2014 and served as the president of the Society of Materials Science, Japan, from 2014 to 2016. His research focuses on fracture mechanics, high temperature strength of heat-resisting materials, fracture nanomechanics, and multiphysics properties of nanomaterials.


Product details

Authors Takayuki Kitamura
Publisher Jenny Stanford Publishing
 
Content Book
Product form Hardback
Publication date 01.08.2025
Subject Natural sciences, medicine, IT, technology > Physics, astronomy > Mechanics, acoustics
 
EAN 9789815129557
ISBN 978-981-5129-55-7
Pages 176
Dimensions (packing) 15.7 x 23.5 x 1.4 cm
Weight (packing) 415 g
 

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.