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The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronicsinto perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbookpresents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packagingtechnology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integrationto the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies indetail. This is followed by fields of application and a look at the future of 3D integration.The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
About the author
Philip Garrou is a consultant in the field of thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals' Advanced Electronic Materials business. He has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters.
Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Molecular Solid-State Technologies (EMFT) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.
Summary
Beiträge von Forschern und Strategen an Universitäten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte für zukünftige Entwicklungen.
